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Extended Bottom Brazing Hybrid Integrated Circuit Package

JOPTEC LASER CO., LTD
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Extended Bottom Brazing Hybrid Integrated Circuit Package

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Cover plate : 4J42(42alloy)

Inner cover plate : Al 2A12

Welding frame : HLAgCu28

Base : Mo80Cu20

Lead : 4J29(Kovar)

Glass insulator : BH-A/k

Welding ring : Au80Si20

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Product name: Metal Base Cavity Kovar/Aluminium Package for IC
Finish: Fully plating Au. (Fully plating or selective plating Au.)
Plating Coating Header and lid are plated Ni:1.3~11.43um and civil levelHeader is plated Au ≥1um military level:Header is plated Au≥1.3um;Lid:civil level Lid is plated Au:0.6~2um;military level:Lid is plated Au:0.6~2um
Product information: Material Quantity
1. Cover plate 4J42(42alloy) 1
2. Inner cover plate Al 2A12 1
3. Welding frame HLAgCu28 1
4. Base Mo80Cu20 1
5. Lead 4J29(Kovar) 6
6. Glass insulator BH-A/k 6
7. Welding ring Au80Si20 6
8. Catheter 4J29(Kovar) 6
9. Welding ring Au80Si20 2
10.Glass insulator / 2
11. Frame 4J29(Kovar) 1
Insulation Resistance 500V DC resistance between pin and base is ≥1*1010Ω
Hermeticity Leak rate is less than 1*10-3 Pa*cm3/s
Product features: 1.The pin material is Kovar,and the base material can be kovar,4J42,CRS1010
2.The sealing cap method is percussion welding,tin welding or laser welding;
3.The pin is cyclinder and straight or nailed pin.
4.The rank of pins usually adopt two or four lines and can be customized
5.The position of ground lead is decided by customers.
6.The design of cap needs matching the dimension of base.
7.Customer choose base fully plating Au or selective plating Au.
8.All index of parameter of product conform to GJB548.

Product Tags:

Extended Bottom hermetic IC package

      

Bottom Brazing Integrated Circuit Package

      

joptec Extended Hybrid Integrated Package

      
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