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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

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JOPTEC LASER CO., LTD

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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Name: Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
Brand: JOPTEC
Price: 1 USD

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Types of Ceramic : Aluminum Nitride AlN

Flatness of chip mounting area : ≤ 2 um

Roughness of chip mounting area : ≤ 0.3 um

Plating thickness : Ni (2-5um)

Water flow : ≥ 300ml/min

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Technical characteristics:

Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min

High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

SMD Hybrid Integrated Circuit Package

Gold Plating Ceramic Integrated Package

JOPTEC Integrated Circuit Package

Gold Plating SMD Ceramic Hybrid Integrated Circuit Package Images