Unusual Lead FormingExtended Bottom ICR Hermetic Packages

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Hermetically Sealed Electronic Packages [19]
Hermetic High Power Laser Package [7]
Hermetic Optical Fiber Communication Package [15]
Butterfly Package [6]
Transistor Outline Package [12]
Hybrid Integrated Circuit Package [4]
Hermetic Infrared Detector Package [3]
TO46 Package [3]
Laser Crystals [7]
Optical Windows [5]
Optical Lens [3]
Optical Prisms [2]
Optical Filters [1]
Polarized Beamsplitter [3]
Wafers And Substrates [2]

JOPTEC LASER CO., LTD

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Unusual Lead FormingExtended Bottom ICR Hermetic Packages

Contact Now

Unusual Lead FormingExtended Bottom ICR Hermetic Packages

Main performance parameters Application fields: ICR package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ...

Product Tags:

0.45μm Gold plating Hermetic Package

ICR hermetically sealed packaging

optimal function Hermetic electronic packages

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